Manufacturing method for RFID tag

Details Manufacturing method for RFID tag Manufacturing method for RFID tag

2008-11-05

2011-11-22

Bugg, George (Department: 2612)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S118000, C438S119000, C257S778000, C029S843000, C156S163000

Reexamination Certificate

active

08062926

ABSTRACT:
An RFID tag manufacturing method is including application process in which a heat-curable adhesive is applied to an area where a circuit chip is placed on a base to which antennae are wired so as to be connected with the circuit chip, placement process in which the circuit chip is placed where the adhesive is applied, and thereby the circuit chip is connected with the antennae, covering process in which the circuit chip placed on the base is covered with a sheet member having an adhesive layer on its surface, such that the adhesive layer faces the base, and heat and pressure applying process in which pressure is applied to the sheet member toward the base, and heat and pressure are applied to the circuit chip from above the sheet member, thereby curing the adhesive and fixing the circuit chip and the sheet member on the base.

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European Search Report dated Mar. 17, 2009, issued in corresponding European Patent Application No. 08168517.4.

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