Manufacturing method for resin sealed semiconductor device

Details Manufacturing method for resin sealed semiconductor device Manufacturing method for resin sealed semiconductor device

2007-09-18

2007-09-18

Potter, Roy (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S124000

Reexamination Certificate

active

11031267

ABSTRACT:
A semiconductor device manufacturing method comprises etching a front side of a conductive board to form plural sets of a die pad portion and bonding areas, each set corresponding to one semiconductor device. Semiconductor chips are mounted on respective ones of the die pad portions using conductive paste. Electrodes of the respective semiconductor chips are electrically connected with metal wires to the bonding areas, and then the front side of the conductive board, including the semiconductor chips, the bonding areas and the metal wires, are sealed with a molding resin to form a resin-sealed body. Thereafter, the whole back side of the conductive board is removed to a depth sufficient to expose the die pad portions and the bonding areas. Then the resin-sealed body is separated into individual semiconductor devices.

REFERENCES:
patent: 6380048 (2002-04-01), Boon et al.
patent: 6420779 (2002-07-01), Sharma et al.
patent: 7109572 (2006-09-01), Fee et al.

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