Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-02-01
2010-11-23
Banks, Derris H (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S827000, C029S829000, C029S830000, C029S831000, C029S847000, C174S261000, C174S263000, C174S265000, C174S267000, C216S013000, C216S017000, C216S018000
Reexamination Certificate
active
07836590
ABSTRACT:
A manufacturing method for a printed circuit board is disclosed. The method includes: forming a first circuit pattern on a metal layer of a conductive carrier, which has the metal layer stacked on one side, pressing the conductive carrier and a first insulation layer together with the first circuit pattern facing the first insulation layer, forming a via by selectively removing the conductive carrier, and removing the metal layer. Using this method, a high-density thin package can be manufactured with increased reliability, and the productivity of the manufacturing process can also be improved.
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Japanese Office Action dated Jun. 3, 2010 and issued in corresponding Japanese Patent Application 2008-067433.
Mok Jee-Soo
Park Jun-Heyoung
Banks Derris H
Carley Jeffrey
Samsung Electro-Mechanics Co. Ltd.
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