Manufacturing method for optical integrated circuit having...

Etching a substrate: processes – Forming or treating optical article

Reexamination Certificate

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C430S321000, C430S323000, C430S325000, C430S330000, C438S031000, C438S040000, C438S043000, C438S713000, C438S978000

Reexamination Certificate

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06913705

ABSTRACT:
A manufacturing method for an optical integrated circuit including a spatial reflection type structure having a perpendicular end surface and an inclined surface formed in an optical waveguide layer. The manufacturing method includes the steps of applying a first photoresist to the upper surface of the optical waveguide layer, removing the first photoresist except a portion corresponding to the inclined surface, and heating the first preferred embodiment to a given temperature to melt the first photoresist at least partially and deform the first photoresist by surface tension, thereby forming a first mask having an inclined shape. The manufacturing method further includes the steps of applying a second photoresist to the upper surfaces of the optical waveguide layer and the first mask, removing the second photoresist at a portion ranging from a position corresponding to the perpendicular end surface to a position corresponding to the upper end of the inclined surface to form a second mask, and etching the first mask, the second mask, and the optical waveguide layer by RIE to thereby simultaneously form the perpendicular end surface and the inclined surface.

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