Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1995-08-25
1996-08-27
Utech, Benjamin
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156277, 427 96, 4271262, 427369, 427370, 4273722, B32B 3100
Patent
active
055497780
ABSTRACT:
A manufacturing method for a multilayer ceramic substrate superior in adhesion between the substrate and thick film pads formed on the surface of the substrate. Copper paste is screen-printed on a glass-ceramics green sheet for forming a surface layer to form a plurality of surface thick film pads respectively connected to a plurality of vias formed in the green sheet. Each of the surface thick film pads is partially covered with a dielectric material. Then, a plurality of green sheets for forming inner layers and the surface-layer green sheet are laminated together so that the surface-layer green sheet forms an uppermost layer. The laminated sheets are bonded integrally with each other by applying heat and pressure, and are then fired at a predetermined temperature for a predetermined time.
REFERENCES:
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patent: 4943470 (1970-07-01), Shiromizu et al.
patent: 5029242 (1991-07-01), Sammet
patent: 5283081 (1994-02-01), Kata et al.
patent: 5359767 (1994-11-01), Chen et al.
Abe Ken-ichiro
Hattori Syouichi
Okada Nobuhide
Soekawa Koji
Suzuki Hitoshi
Fujitsu Limited
Utech Benjamin
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