Manufacturing method for multilayer ceramic elements

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S412000, C029S413000, C029S830000, C029S851000, C029S852000, C174S250000, C174S255000, C174S260000, C174S266000

Reexamination Certificate

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10348024

ABSTRACT:
A multilayer integrated substrate includes breaking grooves arranged in a grid pattern so as to section the main surface of the substrate into a plurality of blocks, and also includes fracture-preventing conductor films arranged so as to cross the breaking grooves. The fracture-preventing conductor films contain a metal component that prevents undesirable fracturing of the multilayer integrated substrate along the breaking grooves.

REFERENCES:
patent: 4792646 (1988-12-01), Enomoto
patent: 5045141 (1991-09-01), Salensky et al.
patent: 5128737 (1992-07-01), Van der Have
patent: 5994762 (1999-11-01), Suwanai et al.
patent: 6235612 (2001-05-01), Wang et al.
patent: 50-018965 (1973-06-01), None
patent: 60-172357 (1985-11-01), None
patent: 09-117910 (1997-05-01), None
patent: 9-117910 (1997-05-01), None
patent: 11-31881 (1999-02-01), None
Official Communication dated Dec. 21, 2005, issued in the corresponding Finnish Patent Application No. 20010401 (with full English translation).

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