Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-01-16
2007-01-16
Tugbang, A. Dexter (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S412000, C029S413000, C029S830000, C029S851000, C029S852000, C174S250000, C174S255000, C174S260000, C174S266000
Reexamination Certificate
active
10348024
ABSTRACT:
A multilayer integrated substrate includes breaking grooves arranged in a grid pattern so as to section the main surface of the substrate into a plurality of blocks, and also includes fracture-preventing conductor films arranged so as to cross the breaking grooves. The fracture-preventing conductor films contain a metal component that prevents undesirable fracturing of the multilayer integrated substrate along the breaking grooves.
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Official Communication dated Dec. 21, 2005, issued in the corresponding Finnish Patent Application No. 20010401 (with full English translation).
Iida Kazuhiro
Sakai Norio
Keating & Bennett LLP
Murata Manufacturing Co. Ltd.
Phan Tim
Tugbang A. Dexter
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