Manufacturing method for integrating passive component...

Details Manufacturing method for integrating passive component... Manufacturing method for integrating passive component...

2008-01-09

2010-12-14

Banks, Derris H (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S829000, C029S830000, C029S832000, C029S839000, C029S840000, C029S846000, C029S852000, C029S855000, C029S867000, C361S761000

Reexamination Certificate

active

07849594

ABSTRACT:
A manufacturing method for integrating a passive component within a substrate is disclosed. The manufacturing method comprises the steps of: providing a circuit layer, wherein a positioning blind hole is formed in the circuit layer; forming a conductive material in the positioning blind hole; positioning the passive component in the positioning blind hole of the circuit layer and electrically connecting the passive component to the circuit layer via the conductive material in the positioning blind hole; and laminating a core layer, the passive component, and the circuit layer as the substrate.

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