Work holders – Plural holders to hold workpieces relative to each other
Patent
1986-08-25
1987-11-03
Schmidt, Frederick R.
Work holders
Plural holders to hold workpieces relative to each other
269115, 269254R, 269307, 269903, B25B 120
Patent
active
047039205
ABSTRACT:
A workholder for holding a plurality of substrates, the workholder configured in a flat plate having a top surface and a bottom surface which is parallel to the top surface. The top surface spaced a distance from the bottom surface, such that the distance between the top surface and the bottom surface does not exceed a distance between an upper surface and a lower surface of an individual substrate. A plurality of substrate receiving openings extend through the plate, each opening being dimensioned to receive a respective substrate therein. A biasing spring means adjacent to each opening for biasing a substrate in the opening. The biasing spring means being between the top and bottom surfaces of the workholder and not extending beyond the top and bottom surfaces thereof. The configuration of the workholder allows the substrates to be held in the openings of the workholder, while having their upper and lower surfaces projecting beyond the top and bottom surfaces of the workholder respectively. This permits manufacturing steps of metallizing the substrates, imaging, plating, resist removal, etching, assembly, wire bonding and so on, to be carried out on all of the substrates in the workholder simultaneously, as well as permitting the processes to be carried out on both sides of the substrates simultaneously, thereby greatly reducing the cost of manufacturing the substrates.
REFERENCES:
patent: 2815813 (1957-12-01), Goldberg
patent: 4201374 (1980-05-01), Gras
patent: 4232815 (1980-11-01), Nakano et al.
patent: 4582245 (1986-04-01), Cartwright
patent: 4582309 (1986-04-01), Moxon et al.
Grabbe Dimitry G.
Korsunsky Iosiff
AMP Incorporated
Hartman Judy J.
Schmidt Frederick R.
Wolstoncroft Bruce J.
LandOfFree
Manufacturing method for integrated circuit chip carriers and wo does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Manufacturing method for integrated circuit chip carriers and wo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method for integrated circuit chip carriers and wo will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1671138