Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-03-28
2006-03-28
Maki, Steven D. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S293000, C156S295000, C156S314000, C029S890100, C347S013000
Reexamination Certificate
active
07018503
ABSTRACT:
The invention relates to a method for attaching a semiconductor chip to an ink jet pen body and improved construction techniques therefor. According to the method a first adhesive have a cure time greater than about 15 minutes is dispensed in a predetermined pattern in one or more chip pockets of an ink jet pen body. Beads containing a second adhesive are dispensed in two or more discrete locations around an inside perimeter of each chip pocket. A semiconductor chip having chip edges is attached to the second adhesive in each of the chip pockets and the first adhesive is cured using heat or radiation. Use of a dual adhesive system improves the alignment of the semiconductor chips relative to one another until the first adhesive is completely cured.
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Corley, Jr. Richard Earl
Murthy Ashok
Reeves Kris Ann
Saldanha Singh Jeanne Marie
Spivey Paul Timothy
Lexmark International Inc.
Luedeka Neely & Graham P.C.
Maki Steven D.
Schatz Chris
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