Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-08-01
2006-08-01
Picardat, Kevin M. (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S107000, C438S124000, C438S459000
Reexamination Certificate
active
07084008
ABSTRACT:
A semiconductor element (111) with electrodes (112), and a passive element (113) with electrodes (113a) are embedded in a thermoplastic sheet base (115), which is then subjected to laser beam machining, electron beam machining or ion beam machining to expose electrodes (112and113a). Thereafter, a circuit pattern (119) is formed by formation of a thin film or printing of a conductive adhesive. Exposing the electrodes by laser beam machining or the like can be carried out in a short period of time and also by local treatment, thereby reducing damage to the base.
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Shingo Sato et al., entitled “Board Reliability of Ceramic CSP by Various Kinds of Solder Material”, at a symposium on “Microjoints and Assembly Technology in Electronics” on Feb. 4-5, 1999, p. 133.
Sakurai Daisuke
Tsukahara Norihito
Picardat Kevin M.
Wenderoth , Lind & Ponack, L.L.P.
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