Semiconductor device manufacturing: process – Making passive device – Trench capacitor
Reexamination Certificate
2011-06-14
2011-06-14
Lindsay, Jr., Walter L (Department: 2812)
Semiconductor device manufacturing: process
Making passive device
Trench capacitor
C438S397000, C257SE21008
Reexamination Certificate
active
07960241
ABSTRACT:
A manufacturing method for double-side capacitor of stack DRAM has steps of: forming a sacrificial structure in the isolating trench and the capacitor trenches; forming a first covering layer and a second covering layer on the sacrificial structure; modifying a part of the second covering layer; removing the un-modified second covering layer and the first covering layer to expose the sacrificial structure; removing the exposed part of the sacrificial structure to expose the electrode layer; removing the exposed electrode layer to expose the oxide layer; and removing the oxide layer and sacrificial structure to form the double-side capacitors.
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Huang Chung-Lin
Huang Shin-Bin
Lee Tzung-Han
Inotera Memories, Inc.
Lindsay, Jr. Walter L
Rosenberg , Klein & Lee
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