Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal
Reexamination Certificate
2001-07-05
2003-11-25
Nguyen, Tuan H. (Department: 2813)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
C438S026000, C438S028000, C438S029000, C438S107000
Reexamination Certificate
active
06653157
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a device including a function block and a manufacturing method therefore.
2. Description of Related Art
Recently, as a mounting method for electronic devices, a mounting method which utilizing an FSA (Fluidic Self-Assembly) method has been developed. This FSA method is a technique wherein electronic devices (hereinafter called “function devices”) which are of predetermined form and of predetermined size from 10 to hundreds of microns are dispersed in a liquid, this liquid is flowed onto a surface of a base body including a hole or a fitting part which are the same size and shape as this function device, the function devices are mounted onto the base body by fitting this function devices into these holes or fitting part.
An FSA method, for example, is disclosed in a journal regarding Information display (S. Drobac, INFORMATION DISPLAY VOL. 11 (1999) pages 12 to 16), U.S. Pat. Nos. 5,545,291, 5,783,856, 5,824,186, and 5,904,545, etc.
Next, an example of a mounting process for a semi-conductor using the FSA method is briefly explained.
1. First, wafers which are made of single crystal silicon and which include hundreds to millions of electronic devices are divided into thousands to millions of function blocks by etching. The function block achieved by this dividing operation has predetermined 3-dimensional form, and each function block has predetermined function. Also, the electronic device may be of a simple construction such as that of a transistor or of a complicated construction such as that of an IC.
2. Separating from the function blocks, the base body into which these function blocks are to be fitted is formed. The holes for fitting function blocks are formed on this base body by carving, by etching, or by laser etc. These hole are formed to conform to the size and the shape of the function blocks.
3. Next, the function blocks formed in this process are dispersed in liquid, and this dispersed liquid is flowed onto the surface of the base body formed in process 2. By this process, function blocks pass over the surface of the base body, and fall into and fit into the holes made on the base body in self-adjusting manner. The function blocks which do not fit into the holes are collected from the dispersed liquid, and are cleaned, and are dispersed again into the cleaned liquid, and are flowed onto other new surface of the base body. During the time wherein the above process is repeated, the function blocks and the dispersed liquid are kept recycled.
4. After being fitted into a hole formed on the base body, the function block is hard-wired by an ordinary method such as a metallizing method, and operates as a part of final electric circuit. By the above process, the function block is mounted onto the semi-conductor device.
According to this FSA method, the cost of a device such as a display can be reduced, and the lead-time for manufacturing can be improved because a large number of function blocks can be mounted onto the base body at one time. Also, the reliability of the device can be improved because the mounting process can be performed by only the pre-inspected, good portions of function blocks.
Also, as a base body for fitting function blocks, various material such as glass, plastic, silicon etc can be used, therefore, the material selectioned to be used as the base body is easily achievable. Also, as a material for the function block, silicon, germanium-silicon, gallium-arsenide, indium-phosphor etc can be choosen according to the necessary functions of the function block. In this way, superior actions and effects are anticipated on FSA method as a mounting method for electronic devices.
BRIEF SUMMARY OF THE INVENTION
By using the device including the function block manufactured by utilizing the FSA method in, for example, an optical device, the development of a highly reliable, low-cost semi-conductor device is sought. An object of the present invention is to provide a device and manufacturing method for a device including a function block.
First Device
In the device including a function block according to the present invention, the function block is made on a concavities formed on the base body. The function block includes a function element at least in one part, and the functionally formed part is formed in a predetermined area on the function block.
Here, the function element is an element which can function as an electronic device. Also, the functionally formed part is of a material which is in the necessary form to produce the predetermined function.
According to this construction, a predetermined function can be exerted by the formation of the functionally formed part in a predetermined area on the function block. There will be a more precise explanation regarding the above-mentioned facts in the detailed description of the invention.
As preferable conditions for the device including the function block, conditions 1 to 4 can be shown as follows.
1. The function block can include a semi-conductor device.
2. The function block can use an optical element as the function element. In this case, the functionally formed part can be formed on the optical element, and can include a lens-shaped part. Here, the optical element should preferably be at least one of a light receiving element or a light emitting element. By this construction, the function of the optical element can be enhanced. More details are given in the detailed description of the invention.
3. Electrodes can be formed in a predetermined area on the function block.
4. Furthermore, a protecting layer can be formed on the function block. In this case, the protecting layer can be formed so as to cover at least one part of the border area between the function block and the base body on the surface of the base body. Furthermore, in this case, a contact hole can be formed in the protecting layer.
Second Device
Also, in the device including the function block according to the present invention, the function block is made on a concavities formed on the base body. Also, the anchoring part for the function block is formed on at least one part of the border area between the function block and the base body on the surface of the base body.
According to this construction, in the case of forming a member on the function block, freer designability can be achieved because the anchoring part can be formed in the minimum necessary area for anchoring the function block.
In this case, the anchoring part is the functionally formed part. Also in this case, the function block can include semi-conductor devices.
First Manufacturing Method
The manufacturing method for the device including the function block in the present invention includes the formation of concavities on the base body, and the self-adjusting fitting process for function blocks having function elements on at least one part into the concavities, and also the manufacturing method of the device including function blocks in the present invention includes the following process (a) and process (b):
(a) process in which liquid stuff is spread on a predetermined area on the function block, and
(b) process in which the liquid stuff is hardened so as to form the functionally formed part.
According to this manufacturing method, simply by supplying the liquid stuff to the function device and by hardening the liquid stuff, the functionally formed part can be formed in self-align manner. As a result, the functionally formed part can be formed by a very simple process without alignment offset.
Second Manufacturing Method
The manufacturing method for the device including the function block in the present invention includes the formation of concavities on the base body, and the self-adjusting fitting process for the function block having the function element on at least one part into the concavity, and also the manufacturing method of the device including the function block in the present invention includes the following process (a) and process (b):
(a) process in which a liquid stuff is spread o
Nguyen Tuan H.
Seiko Epson Corporation
LandOfFree
Manufacturing method for device including function block,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Manufacturing method for device including function block,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method for device including function block,... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3146521