Metal fusion bonding – Process – Applying or distributing fused filler
Reexamination Certificate
2002-05-01
2003-11-11
Elve, M. Alexandra (Department: 1725)
Metal fusion bonding
Process
Applying or distributing fused filler
C228S249000, C205S114000, C205S070000
Reexamination Certificate
active
06644537
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention is related to a manufacturing method for electroforming metallic mold, and more particularly to a manufacturing method for bonded electroforming metallic mold. By means of the manufacturing method, the connecting interface of the mold is rigid and firm as well as the processing is significantly speeded. In addition, the connecting interface is uneasy to deform under high temperature.
The existent measures for connecting an electroforming metallic plate with a steel mold core by way of electroforming respectively have some shortcomings as follows:
In the case of vacuum sucking method, the demanded thickness of the electroforming plate can be quickly achieved. However, the mold must be very precisely manufactured, an additional expensive vacuum equipment is required, and the maintenance of the mold is quite difficult.
In the case of flame fusion injection or laser welding method, the electroforming metallic plate will be deformed and will damage the surface profile of the electroforming metallic plate.
Alternatively, in the case of mechanical insertion or screw tightening method, the electroforming metallic plate must have a considerably thickness. As a result, the electroforming time will be considerably lengthy.
By using the conventional electroforming method, of course an electroforming metallic plate with a sufficient thickness can be formed, For example, the thickness is 3 mm (3000 &mgr;m) and the growth rate of electroforming is 0.4 &mgr;m per minute. The deposition is one-way performed, so that theoretically it needs 7500 minutes to complete the deposition. In other words, the deposition will take 125 hours, that is, 5.2 days. Therefore, it is very time-consuming. Furthermore, after electroforming, the internal stress is still remained in the thick material so that the deposited material tends to deform.
Please refer to
FIG. 1. A
previously designed and manufactured plastic mold core
92
is disposed on an electroforming substrate
91
. Insulated plates
93
are disposed on its two sides. After completing the electroforming procedure, the original extremely thin electroforming metallic film
90
becomes quite thick (assuming its thickness grows up from several hundreds &mgr;m to 3 mm). Under such circumstance, the internal stress will be remained, so the deposited material tends to deform as shown in the exaggerated view of FIG.
1
.
Therefore, it is necessary to develop a new measure to solve the above problems.
SUMMARY OF THE INVENTION
It is therefore a primary object of the present invention to provide a manufacturing method for bonded electroforming metallic mold. In this manufacturing method, a metallic material with a considerable thickness is utilized and the electroforming deposition is simultaneously inward (two-way) performed on two connecting faces. After the electroforming deposition procedure is done, the bonding interface is rigid and firm, and the manufacturing time for the mold is significantly shortened.
It is a further object of the present invention to provide a manufacturing method for bonded electroforming metallic mold. By using this manufacturing method, the connecting interface is uneasy to deform under high temperature.
According to the above objects, the manufacturing method for bonded electroforming metallic mold of the present invention includes steps of: 1. preparation of metallic material 2. preparation of electroforming metallic plate and plastic mold core and electroforming substrate; 3. preparation of power supply; 4. forming of electroforming deposited film; and 5. final-shaping.
REFERENCES:
patent: 4349145 (1982-09-01), Shinopulos et al.
patent: 5242099 (1993-09-01), Ueda
patent: 5501784 (1996-03-01), Lessmollmann et al.
patent: 5632878 (1997-05-01), Kitano
patent: 5783259 (1998-07-01), McDonald
patent: 61127885 (1986-06-01), None
Cheng Chi Feng
Chiu Shao Chen
Yang Hsiharng
Elve M. Alexandra
McHenry Kevin
Rosenberg , Klein & Lee
Taiwan Green Point Enterprise Co., Ltd.
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