Manufacturing method for an electronic part absorbing nozzle

Metal working – Method of mechanical manufacture – Gas and water specific plumbing component making

Reexamination Certificate

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Details

C029S557000

Reexamination Certificate

active

06282787

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to an electronic part adsorbing nozzle to be used for electronic part mounting machines and a manufacturing method thereof.
BACKGROUND OF THE INVENTION
Electronic part mounting machines use electronic part adsorbing nozzles for adsorbing or suction holding required electronic parts and mounting them at predetermined locations on circuit boards.
Used as a known electronic part adsorbing nozzle is a nozzle made of a super hard metal, in which a tip thereof has a nozzle opening formed in a predetermined shape and an adsorbing surface coated with diamond for imparting abrasion resistance and a magnetization-preventive function.
The nozzle opening mentioned above consists, for example, of a center slit and “V-shaped” slits extending from the middle of the center slit symmetrically rightward and leftward, and formed symmetrical with regard to a vertical center axis and a horizontal center axis respectively of the adsorbing surface. Owing to this shape, the nozzle opening is configured so as to have adsorbing portions for exerting an adsorbing force to an electronic part and supporting portions for receiving the electronic part, which portions are distributed alternately and uniformly so that the nozzle can cope with variations in size and deviations in locations of electronic parts.
However, the known electronic part adsorbing nozzle having the configuration described above poses problems which are described below:
The known electronic part adsorbing nozzle is often threatened to be defective, and inevitably requires a high manufacturing cost due to low yield since the coating material often protrudes into the nozzle opening at a stage to coat the adsorbing surface of the tip with diamond.
Further, the known adsorbing nozzle poses a problem from a viewpoint of compressive resistance since the nozzle opening is composed of the radially formed “V-shaped” slits, the supporting portions naturally have acute angles in an adsorbing condition and tips of the portions having the acute angles are liable to be broken. This problem will be described more concretely. When an electronic part which has an area smaller than a half of the nozzle opening is adsorbed, an adsorbing force is exerted to the electronic part only within a central region of the nozzle opening, the adsorbing force exerting to the electronic part is received by the supporting portions having the acute angles and a stronger compressive force is loaded on the supporting portions having the acute angles at a stage to mount the electronic part onto a circuit board, whereby the supporting portions having the acute angles located at the tip of the nozzle are liable to be broken.
Furthermore, the known electronic part adsorbing nozzle poses another problem that it is obliged to be disposed of when its tip becomes defective since the nozzle is formed as an integral part ranging from its tip having the diamond coating to a mounting shank (grip) and the nozzle cannot be repaired simply by replacing the nozzle tip with a new one when it is broken.
DISCLOSURE OF THE INVENTION
It is therefore a primary object of the present invention to provide an electronic part adsorbing suction holding nozzle which is economical and excellent in durability in production and use by solving the problems described above.
For accomplishing this object, the electronic part adsorbing nozzle according to the present invention is configured to be characterized in that it has a nozzle opening of a nozzle slot, which consists of a center slit and “U-shaped” slits which are formed on both sides of a longitudinal direction of the center slit so as to open outward and symmetrical with each other.
By configuring an electronic part adsorbing nozzle as described above, it is possible to make portions for supporting an electronic part free from acute angles without lowering adsorbing stability for the electronic part and obtain an electronic part adsorbing nozzle excellent in compressive resistance since the nozzle opening formed in the nozzle slot consists of the center slit and the “U-shaped” slits formed on both sides of the longitudinal direction of the center slit, and adsorbing portions for exerting an adsorbing force to the electronic part and supporting portions for receiving the adsorbed electronic part are distributedly disposed. Further, this configuration permits enhancing workability since it makes an adsorbing port free from portions having acute angles and minute portions having acute angles in particular.
Furthermore, a manufacturing method of an electronic part adsorbing nozzle according to the present invention is characterized in that it comprises a first step to form a nozzle rod by fixing a diamond chip to a tip of a nozzle pipe, a second step to form a joint portion for a shank by thinning the other end of the nozzle rod on a side of the nozzle pipe to a predetermined size, a third step to join the nozzle rod with the shank, a fourth step to shape a tip of the nozzle rod and vicinities thereof so as to have a predetermined section, a fifth step to form a center hole in the diamond chip and a sixth step to form a nozzle slot by expanding the center hole in the vicinities of the tip of the nozzle into a predetermined shape.
The manufacturing method described above permits manufacturing a nozzle of any required kind simply and at a high yield by cutting, together with a diamond chip, a tip and vicinities of a nozzle rod which is formed by fixing a diamond chip to a tip of a nozzle pipe so as to have a predetermined sectional shape, and forming a nozzle slot having a predetermined shape.


REFERENCES:
patent: 2390298 (1945-12-01), Glassner
patent: 3147017 (1964-09-01), Dunham
patent: 4559718 (1985-12-01), Tadokoro
patent: 4767142 (1988-08-01), Takahashi et al.
patent: 4875279 (1989-10-01), Sakiadis
patent: 5407503 (1995-04-01), Matsui et al.
patent: 209 739 (1989-08-01), None

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