Manufacturing method for a semiconductor device

Details Manufacturing method for a semiconductor device Manufacturing method for a semiconductor device

2007-03-20

2007-03-20

Chaudhari, Chandra (Department: 2891)

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Electrical characteristic sensed

C438S018000

Reexamination Certificate

active

10936009

ABSTRACT:
A manufacturing method for a semiconductor device which is capable of manufacturing the semiconductor device with a high quality in high yields while reducing variations in electric characteristic is disclosed. The manufacturing method according to the present invention includes a main body wafer manufacturing process for manufacturing a wafer on which a semiconductor device to be completed as a product is formed and a monitor wafer manufacturing process for manufacturing a wafer on which a monitor element is formed, the processes sharing a monitoring step alone, the main body wafer manufacturing process including a variation reduction step, the monitor wafer manufacturing process including a quality check step and a condition setting step.

REFERENCES:
patent: 5753556 (1998-05-01), Katada et al.
patent: 6258613 (2001-07-01), Iwamatsu
patent: 6304999 (2001-10-01), Toprac et al.
patent: 6551847 (2003-04-01), Asahina et al.
patent: 6593154 (2003-07-01), Marume et al.
patent: 6618120 (2003-09-01), Ueta
patent: 6785583 (2004-08-01), Oishi et al.
patent: 2002/0107660 (2002-08-01), Nikoonahad et al.
patent: 2002/0182757 (2002-12-01), Conchieri et al.
patent: 2003/0082837 (2003-05-01), Pasadyn et al.
patent: 2004/0051148 (2004-03-01), Johnson et al.
patent: 2004/0083021 (2004-04-01), Somekh et al.
patent: 2004/0102857 (2004-05-01), Markle et al.
Sischka, Frank; Characterization Handbook; Oct. 11, 2003; Agilent, http://eesof.tm.agilent.com/docs/iccap2002/MDLGBOOK/1MEASUREMENTS/2CV/CV.pdf.

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