Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2009-04-14
2010-12-21
Thai, Luan C (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S125000, C438S126000, C257S679000, C257SE23064
Reexamination Certificate
active
07855099
ABSTRACT:
A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an input/output interface circuit to an external computer over a Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Supporting end ribs under each of the SD contact pads and middle ribs support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB, and slants downward at the insertion end to position the SD contact pads near the centerline.
REFERENCES:
patent: 6381143 (2002-04-01), Nakamura
patent: 6580615 (2003-06-01), Nakanishi et al.
patent: 6910635 (2005-06-01), Miks et al.
patent: 7264992 (2007-09-01), Hsueh et al.
Hsueh Paul
Ma Abraham C.
Ni Jim Chin-Nan
Shen Ming-Shiang
Auvinen Stuart T.
gPatent LLC
Super Talent Electroncis, Inc.
Thai Luan C
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