Manufacturing method for a printed circuit board

Details Manufacturing method for a printed circuit board Manufacturing method for a printed circuit board

2007-07-10

2007-07-10

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S846000, C029S850000, C029S878000, C174S260000, C174S261000, C174S262000, C257SE23062, C257SE23077, C361S738000, C361S760000

Reexamination Certificate

active

10909434

ABSTRACT:
A conductor pattern is formed on a resin film which is made of a thermoplastic resin. Each single-sided conductor pattern film has via-holes filled with an electrically conductive paste. A printed conductor pattern and a printed resistor are formed on a ceramic substrate. The single-sided conductor pattern films are laminated on the ceramic substrate. Then, the multilayered assembly is heated and pressed from both sides thereof to obtain a printed circuit board. During the heat and press treatment, respective single-sided conductor pattern films and the ceramic substrate bond together while the interlayer connection is obtained between the conductor patterns as well as between the conductor pattern and the printed conductor pattern.

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Notification of Reasons for Rejection from Japanese Patent Office issued on Feb. 21, 2006 for the corresponding Japanese patent application No. 2001-179117 (a copy and English translation thereof).

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