Manufacturing method by treating substrate introduced into...

Plastic and nonmetallic article shaping or treating: processes – Repairing or restoring consumer used articles for reuse – Hollow- or container-type articles

Reexamination Certificate

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Details

C264S039000, C705S330000, C705S340000, C220S495010, C220S023870, C220S528000, C220S529000, C206S307000, C206S307100, C206S710000

Reexamination Certificate

active

07842205

ABSTRACT:
The present invention provides a manufacturing method by which a substrate (typically, a TFT substrate) can be installed directly in a treatment apparatus by using a transfer container without shifting the substrate from the transfer container to another container. It is possible to use the container efficiently and transfer different substrates in size with one container. A manufacturing method in which a substrate is directly installed in an electrostatic-protected transfer container by a substrate supplier, and then the container is directly installed in a treatment apparatus by a substrate demander after transferring can be realized, thereby making it possible to transfer substrates such as a TFT substrate. A contamination of a substrate due to particles and electrostatic discharge damage of a TFT substrate can be avoided because a transferring operation is not needed. A manufacturing method in which a substrate holding portion of the container is replaced depending on the size of a substrate and different substrates in size can be transferred with one container may be employed.

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