Manufacturing method and structure of copper lines for a...

Details Manufacturing method and structure of copper lines for a... Manufacturing method and structure of copper lines for a...

2005-12-27

2005-12-27

Williams, Joseph L. (Department: 2879)

Electric lamp or space discharge component or device manufacturi

Process

With assembly or disassembly

Reexamination Certificate

active

06979242

ABSTRACT:
In those conventional arts, for large-size LCD, the process of copper damascene interconnect has some problems of forming a uneven copper seed layer and forming hollows during electrical plating due to the electrical plating area being too large to electroplate uniformly. In this invention, it employs a Cu tape to directly stick on a substrate to replace forming a copper seed layer and electroplating. Hence, the invention avoids the problem of unevenness and hollows in those conventional arts and so the Cu lines can be applied to the large-size LCD.

REFERENCES:
patent: 6468873 (2002-10-01), Liu et al.

Affiliated with

Also associated with

Rating

Manufacturing method and structure of copper lines for a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacturing method and structure of copper lines for a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method and structure of copper lines for a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3519675