Manufacturing method and structure for a substrate with...

Details Manufacturing method and structure for a substrate with... Manufacturing method and structure for a substrate with...

2011-08-09

2011-08-09

Norris, Jeremy C (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C361S761000

Reexamination Certificate

active

07994429

ABSTRACT:
A manufacturing method and structure for substrate with vertically embedded capacitors includes the steps of providing a plurality of conductive layers having a first dielectric layer and a leading wire layer formed on the first dielectric layer, providing a plurality of composite layers having a second dielectric layer and a patterned electrode layer formed on the second dielectric layer, laminating the conductive layers and the composite layers to form a block which defines a plurality of substrates with vertically embedded capacitors and a plurality of sawing streets between the substrates, and sawing the block along the sawing streets to singularize the substrates.

REFERENCES:
patent: 7778039 (2010-08-01), Chen et al.

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