Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2001-07-10
2003-12-16
Mayes, Curtis (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S089120, C156S249000, C156S345420, C156S510000, C156S556000, C156S570000, C156S583200
Reexamination Certificate
active
06663740
ABSTRACT:
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a manufacturing method and a manufacturing apparatus of a thin-film laminate. More particularly, the invention relates to a manufacturing method and a manufacturing apparatus of a thin-film laminate for manufacturing a thin-film laminate such as a multi-layer circuit board by laminating thin-film sheets made of a ceramic material having conductor patterns printed on the surface thereof.
BACKGROUND ART
As a manufacturing method of a thin-film laminate for manufacturing a thin-film laminate such as a substrate for LSI package, a multi-layer board or a laminated capacitor (chip capacitor), there is conventionally available a manufacturing method for manufacturing a thin-film laminate, comprising the steps of forming continuously green sheets (raw ceramic sheets) by a method known as the tape forming method on the surface of a flexible strip-shaped substrate called a carrier film piece, cutting the resultant green sheets into a prescribed size, forming a conductive pattern on each sheet by pattern printing or the like, and pressing and laminating the individual sheets, thereby manufacturing a thin-film laminate.
The aforementioned green sheet expands, contract or deforms shortly after peeling thereof from the carrier film piece, and should therefore preferably be integrated with the carrier film piece until immediately before lamination. Therefore, it is the conventional practice to cut the green sheets and the carrier film piece integrally into a prescribed size, and repeat the operating cycle of pressing the green sheets and separating the carrier films, thereby manufacturing a thin-film laminate.
More specifically, as shown in
FIG. 17
, a two-layer sheet piece N′, having a prescribed size, prepared by integrally cutting a green sheet bearing a conductive pattern printed thereon (hereinafter referred to as a “conductive sheet”) G′ and a carrier film piece F′ is placed on a green sheet (hereinafter referred to as a “dummy sheet”) not bearing a conductive pattern printed thereon previously laminated on the laminating base
101
so that the conductive sheet G′ comes into contact with the dummy sheet D′, and the resultant laminate is pressed (refer to FIG.
17
(
a
)). Then, lamination of a single conductive sheet G′ is completed by peeling off the carrier film piece F′ by sticking, for example, an adhesive tape (refer to FIG.
17
(
b
)). A thin-film laminate is manufactured by laminating a prescribed number of conductive sheets G′ in this manner. In this manufacturing method, positioning for lamination is carried out by fitting pin holes
102
and
102
formed in the two-layer sheet piece N′ onto pins
103
and
103
provided at positions corresponding to the pin holes
102
and
102
on the laminating base
101
.
The above-mentioned manufacturing method of a thin-film laminate as described above has the following problems:
(1) It takes much time to carry out the operation of peeling off the carrier film piece F′ by means of an adhesive tape, and it is necessary to replace an adhesive having a reduced adhesion, resulting in a very low productivity.
(2) The conductive sheet G′ is pressed under a considerable pressure to prevent the conductive sheet G′ from peeling off together with the carrier film piece F′ during stripping. The conductive sheets G′ already laminated through repeated pressing is deformed.
(3) Positioning by means of the pin hole
102
and the pin
103
causes a shift of laminating position by an allowable difference between the pin hole
102
and the pin
103
.
For the purpose of solving these problems in the conventional art, for example, a manufacturing apparatus of a thin-film laminate as shown in
FIG. 18
is proposed in Japanese Laid Open Patent Publication No. 10-284346. This manufacturing apparatus J′ is based on a process comprising the steps of setting a carrier film F′, on the surface of which conductive sheets G′ bearing conductive patterns printed at prescribed intervals are continuously formed in a delivery unit
101
; paying off the carrier film F′ from the delivery unit
101
; sending the same by means of a rollers group
102
to a cutting base
103
by a prescribed length; cutting the conductive sheets G′ to a prescribed size by means of a sheet cutting-carrying head
104
on the cutting base
103
; holding by sucking each of the cut conductive sheets G′ by means of the cutting-carrying head
104
and transferring the same to above a laminating base
105
; and forming a laminate S′ by pressing and laminating a prescribed number of conductive sheets G′ on the laminating base
105
.
In this manufacturing apparatus J′, a laminating position is determined by picking up an image of positioning marks printed at prescribed intervals at positions corresponding to the conductive patterns on the conductive sheets G′ by means of a CCD pickup apparatus
106
, and correcting the amount of transfer of the sheet cutting-carrying head
104
on the basis of the image thus picked up. The aforementioned problems are substantially solved by this manufacturing apparatus J′. However, while this manufacturing apparatus J′ is suitable for manufacturing a thin-film laminate bearing only a single kind of conductive pattern printed on the conductive sheets G′ to be laminated, it involves a problem in that it is not suitable for manufacturing a thin-film laminate having 10 to 20 kinds of conductive patterns to be printed on the conductive sheets G′ laminated as in a multi-layer substrate incorporated, for example, in a next-generation cellular phone. More specifically, in order to manufacture a thin-film laminate having even 10 to 20 kinds of conductive patterns in the manufacturing apparatus J′, it is necessary to print 10 to 20 kinds of conductive patterns on the green sheets G′ in the laminating sequence. The problem is that this leads to a very complicated printing operation.
The present invention was developed in view of these problems in the conventional art, and has an object to provide a manufacturing method and a manufacturing apparatus of the thin-film laminate, which do not require any complicated printing operation of conductive patters, and permit a high-accuracy lamination of conductive sheets, even when there are various kinds of the conductive patters to be printed on laminated green sheets.
SUMMARY OF THE INVENTION
The manufacturing method of a thin-film laminate of the present invention is a method for manufacturing the thin-film laminate by sequentially laminating thin-film sheets having conductive patterns formed thereon, comprising the steps of:
housing thin-film sheets held by carrier films adjusted to a prescribed size in housing cases; and, in the middle of conveyance of the thin-film sheets in a state held by the carrier films and taken out from the housing case to a pressing and laminating position, stripping the thin-film sheets off the carrier films while conveying the same.
The manufacturing method of a thin-film laminate of the invention further comprises the steps of causing a carrier to hold the thin-film sheets, and causing a stripping member to penetrate into the boundary between the thin-film sheets and the carrier films, thereby to strip the thin-film sheets from the carrier films.
Moreover, in the manufacturing method of a thin-film laminate of the invention, it is desirable that the length of the carrier film in the conveying direction is longer than the thin-film sheet, and the increment portion of the length is projected in the conveying direction, and the stripping member is caused to penetrate into the boundary between the thin-film sheet and the carrier film while moving the stripping member along the projecting portion.
Further, the manufacturing method of a thin-film laminate of the invention may comprise the steps of forming an unnecessary portion integrally with the thin-film sheet of the
Mayes Curtis
New Create Corporation
Rader Fishman & Grauer
LandOfFree
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