Manufacturing method and manufacturing apparatus for ceramic ele

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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156 64, 15624411, 15624416, 156246, 156277, 156289, 1014151, 101474, 101DIG46, 425113, 2641761, 427 58, 427 96, B32B 3112, B32B 3130, B32B 3500

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057164819

ABSTRACT:
According to the present invention, ceramic electronic components are produced by a process which includes the steps of forming an unbaked ceramic layer on a surface of an organic flexible supporting body by applying a ceramic paste, the surface having an area that is given a peeling treatment and areas that are not given the peeling treatment; forming first target marks on the flexible supporting body; and positioning and priming electrodes on the unbaked ceramic layer, based upon information obtained through image processing of the first target marks.

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patent: 5505809 (1996-04-01), Yamamoto et al.
Richerson, D.W., Modern Ceramic Engineering, pp. 471-477, 1992.

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