Manufacturing method and manufacturing apparatus for ceramic ele

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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156 64, 15624411, 15624416, 156246, 156277, 156289, 156361, 156378, 156387, 1014151, 101474, 101DIG46, 427 58, 427 96, B32B 3112, B32B 3130, B32B 3500

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059353651

ABSTRACT:
An unbaked ceramic layer is formed by applying a ceramic paste on to an organic flexible supporting body. First target marks are formed on the flexible supporting body before or after this process. Then, the positioning for printing electrodes is performed based upon information obtained through image processing of the first target marks, to print the electrodes on the unbaked ceramic layer. With this, a manufacturing method for ceramic electronic components that can minimize positional misalignment in electrode patterns is provided.

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