Manufacturing method and bonding apparatus with vacuum chuck...

Liquid crystal cells – elements and systems – Nominal manufacturing methods or post manufacturing...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C349S190000

Reexamination Certificate

active

07050141

ABSTRACT:
A manufacturing method and a bonding apparatus for a liquid crystal display device is provided for that makes it possible to expel remaining bubbles from a liquid crystal and to bond an array substrate and a color filter substrate while maintaining their positional relationship. In a step for bonding an array substrate with a liquid crystal applied thereto and a color filter substrate, vacuum holding of only a central retaining region of an upper vacuum chuck of the bonding apparatus is stopped. This causes the central portion of the color filter substrate to come in contact with the array substrate due to its own weight. The contact region is pressed by a holder to secure the positional relationship between the array substrate and the color filter substrate. Thereafter, with the elapse of time, the upper vacuum chuck increases the retaining region for which a vacuum retaining operation is stopped so as to expand the area of contact between the array substrate and the color filter substrate. As a result, bubbles in the liquid crystal are expelled externally.

REFERENCES:
patent: 5455696 (1995-10-01), Saito et al.
patent: 6636290 (2003-10-01), Glownia et al.
patent: 6798488 (2004-09-01), Murata et al.
patent: 2003/0179336 (2003-09-01), Ryu et al.
patent: 05-181443 (1993-07-01), None
patent: 07-199855 (1995-08-01), None
patent: 11-007273 (1999-01-01), None
patent: 11-102278 (1999-04-01), None
patent: 2000-112447 (2000-04-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Manufacturing method and bonding apparatus with vacuum chuck... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacturing method and bonding apparatus with vacuum chuck..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method and bonding apparatus with vacuum chuck... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3639764

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.