Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With separate heating means for work
Reexamination Certificate
2007-08-21
2007-08-21
Koch, George (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With separate heating means for work
C156S566000, C156S578000, C156S580000
Reexamination Certificate
active
11415533
ABSTRACT:
Disclosed herein is a method including the steps of cutting a wafer to prepare a row block having a plurality of head elements arranged in a matrix, bonding a plate member to one side surface of the row block, bonding a row tool to another side surface of the row block bonded to the plate member opposite to the one side surface, and cutting the row block to prepare a row bar bonded to the row tool and having a row of the head elements. A bonding apparatus for realizing the above bonding steps is also disclosed.
REFERENCES:
patent: 5694677 (1997-12-01), Tsunoda
patent: 6332264 (2001-12-01), Itoh et al.
patent: 2003/0074785 (2003-04-01), Kubota et al.
patent: 10-277469 (1998-10-01), None
Machine Translation of JP 10-277469 (document cited in IDS).
Nomura Michinao
Sugiyama Tomokazu
Yanagida Yoshiaki
Fujitsu Limited
Greer Burns & Crain Ltd
Koch George
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