Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1987-04-16
1988-08-16
Godici, Nicholas P.
Metal fusion bonding
Process
With condition responsive, program, or timing control
228105, 228 62, 228 47, B23K 3100
Patent
active
047638273
ABSTRACT:
The invention relates to a manufacturing apparatus which comprises moving means which continuously moves the works that are transferred along a frame chute, and detector means which detects at least a portion of the work that is moved. The moving means is controlled by kind-of-work data and by a work position signal from the detector means, and the work is set to a predetermined position. Hence, even a work of a different kind can be set to an optimum bonding position without the need of exchanging the unit, making it possible to perform the operation fully automatically and to meet general purposes.
Further, provision is made of means which moves the frame chute in a direction at right angles with the direction in which the work is moved, so that even that work that has different widths and shapes in the widthwise direction can be placed in position and subjected to the bonding fully automatically.
The detector means can be provided not only at the bonding position but also at a position on the upstream side having a relation relative to the bonding position.
The invention can be adapted particularly effectively to a wire bonder and a pellet bonder.
REFERENCES:
patent: 3973713 (1976-08-01), Furuya et al.
patent: 4301958 (1981-11-01), Hatakenaka et al.
patent: 4526646 (1985-07-01), Suzuki et al.
patent: 4674670 (1987-06-01), Watanabe et al.
Kakutani Osamu
Kyomasu Ryuichi
Mimata Tsutomu
Takasugi Nobuhiro
Watanabe Kenji
Godici Nicholas P.
Hitachi , Ltd.
Hitachi Tokyo Electronics
Skillman Karen
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