Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With cutting – punching – piercing – severing – or tearing
Patent
1996-09-12
2000-02-08
Jones, Deborah
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With cutting, punching, piercing, severing, or tearing
29825, 29829, 29846, 156150, 205666, 221 1, 427 96, H05K 346
Patent
active
060218339
ABSTRACT:
A manufacturing line including a plurality of processing sections disposed in a series for manufacturing multi-layered printed circuit boards by continuously conveying and processing boards through the plurality of processing sections, in which the plurality of processing sections have at least two specific processing sections for conducting a common type of processes, and the specific processing sections are disposed in a common area.
REFERENCES:
patent: 5628112 (1997-05-01), Maslar et al.
Arai Keiji
Fujita Ryo
Goto Tohru
Higuchi Shuji
Kobayashi Takanori
Fujitsu Limited
Jones Deborah
Koehler Robert R.
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