Metal fusion bonding – Process – Preplacing solid filler
Patent
1995-05-24
1997-03-11
Heinrich, Samuel M.
Metal fusion bonding
Process
Preplacing solid filler
2281801, H05K 334
Patent
active
056092920
ABSTRACT:
Rectangular preforms are vacuum picked and placed in each cavity of a first holder, and a measured amount of no-clean flux liquid is dispensed onto each preform, then a second holder is placed in an inverted position (upside-down) on top of the first holder and the holders are flipped so that the dry side of the preform is exposed and then a measured amount of no-clean solder is dispensed on the dry side of the preform. The holders are unstacked and positioned on different sized posts extending upward from a pick-and-place machine. A robot arm with a rubber tipped vacuum probe picks up the preforms without damage or contamination and places them on a circuit board, grippers of the robot arm pick up and position a component on an induction coil to heat it up sufficient for reflow soldering, and then move the component onto the preform on the circuit board for reflow soldering.
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Belk Michael E.
Heinrich Samuel M.
International Business Machines - Corporation
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