Manufacturing circuit boards dipped in molten solder

Details Manufacturing circuit boards dipped in molten solder Manufacturing circuit boards dipped in molten solder

1995-06-30

1997-11-04

Bareford, Katherine A.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427436, B05D 118, B05D 512

Patent

active

056837437

ABSTRACT:
Solder is applied to a circuit structure 7 by dipping the structure into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The structure is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit structure. This is achieved by supporting the structure on a carrier 9 which in turn is attached to a motor shaft 11.

REFERENCES:
patent: 5520967 (1996-05-01), Banks et al.
Japan Abstract 3-114665 (Aug. 1991).
Japan Abstract 2-50492 (May 1990).

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