Manufacturing CCDs in a conventional CMOS process

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation

Reexamination Certificate

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C438S144000, C438S148000, C257SE21617

Reexamination Certificate

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11091722

ABSTRACT:
A technique for forming Charge-Coupled Devices (CCDs) in a conventional Complementary Metal Oxide Semiconductor (CMOS) process. A number of single-layer polysilicon gates are formed on an as-grown, native doped silicon substrate, with gaps between them. Masking is used to selectively dope the gates while preventing doping of the silicon in the gaps. Masking may likewise be used to selectively silicide the gates while preventing silicide formation in the gaps. Conventional source-drain processing produces input/output diffusions for the CCD.

REFERENCES:
patent: 3865652 (1975-02-01), Agusta et al.
patent: 4900688 (1990-02-01), Halvis
patent: 4906584 (1990-03-01), Blouke et al.
patent: 6417057 (2002-07-01), Takemura et al.

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