Manufacturing a bump electrode with roughened face

Details Manufacturing a bump electrode with roughened face Manufacturing a bump electrode with roughened face

2007-06-19

2007-06-19

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S739000

Reexamination Certificate

active

10988553

ABSTRACT:
The invention includes a semiconductor device, and a method for making the same, wherein bumps of a semiconductor chip and inner leads of a film tape carrier can be securely bonded to each other by thermal welding using a heating unit. A semiconductor wafer is etched using a potassium iodide or ammonium iodide solution. By the etching, a barrier metal layer is removed while the upper face of a bump is simultaneously roughened and many prominences are formed. The formation of the prominences increases the surface area of the upper face of the bump10and improves the bonding between the bump of the semiconductor chip and the lead of the film tape carrier.

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