Manufacture of thinned substrate imagers

Details Manufacture of thinned substrate imagers Manufacture of thinned substrate imagers

1979-11-29

1981-05-12

Walton, Donald L.

Metal working

Method of mechanical manufacture

Assembling or joining

29590, H01L 2196

Patent

active

042663342

ABSTRACT:
The front surface of a semiconductor wafer and the peripheral edge of the back surface of the wafer are protected by either coating them or by placing the wafer in a special fixture. The so protected wafer is then placed in a chemical bath and thinned to the desired thickness over the entire center region of the back surface. Then a sheet of glass which fits into the thin region within the unthinned rim on the back surface is glued to the back surface to provide a laminated structure. Next, the individual imager devices are separated from one another by cutting through the glass and thinned substrate along lines between the devices.

REFERENCES:
patent: 3800194 (1974-03-01), Maruyama et al.
patent: 3864819 (1975-02-01), Ying
patent: 3900882 (1975-08-01), Fukai et al.
patent: 3966512 (1976-06-01), Nonaka
patent: 4007473 (1977-02-01), Nonaka et al.
patent: 4029394 (1977-06-01), Araki
patent: 4068253 (1978-01-01), Fuyiwara et al.
patent: 4099198 (1978-07-01), Howorth et al.
Antcliffe et al., A Backside Illuminated 400.times.400 Charge-Coupled Device Imager, IEEE Trans. on Electron Devices, vol. ED-23, No. 11, Nov. 1976, pp. 1225-1232.

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