Manufacture of supports for semiconductor devices

Details Manufacture of supports for semiconductor devices Manufacture of supports for semiconductor devices

1974-11-19

1976-05-25

Smith, Al Lawrence

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228 14, 83152, H01L 2158

Patent

active

039587428

ABSTRACT:
Apparatus in which gold tape is to be servered and placed on selected parts of support members of supports for semiconductor devices has means to feed the tape to severing means including a reciprocatable dog to engage the tape. The dog may pierce or indent the tape, or may frictionally engage the tape.

REFERENCES:
patent: 1589176 (1926-06-01), Hubbard
patent: 3032862 (1962-05-01), Fastre et al.
patent: 3585711 (1971-06-01), Hicks
patent: 3667331 (1972-06-01), Regel et al.

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