Manufacture of solid-solder-deposit PCB utilizing...

Details Manufacture of solid-solder-deposit PCB utilizing... Manufacture of solid-solder-deposit PCB utilizing...

2005-03-29

2005-03-29

Edmondson, L. (Department: 1725)

Metal fusion bonding

Process

Specific mode of heating or applying pressure

C228S248100, C228S245000

Reexamination Certificate

active

06871776

ABSTRACT:
A process and apparatus for manufacturing Solid Solder Deposit-Printed Circuit Board (SSD-PCB) by melting dry solder powder previously deposited on a pocketed-PCB20. The process and apparatus utilize as heat source an electrically heated conveyor wire mesh76instead of a reflow oven. This invention, unlike the prior art for producing SSD-PCB, can readily utilize dry solder powder in conjunction with flux layers116separately deposited on top of the conveyor wire mesh76thereby excluding the use of solder paste and associated paste printing equipment. Specifically the invention reduces the manufacturing cost because: shortens manufacturing time, reduces manufacturing energy consumption and requires less manufacturing equipment than prior art.

REFERENCES:
patent: 4260675 (1981-04-01), Sullivan
patent: 5407488 (1995-04-01), Ray
patent: 5934545 (1999-08-01), Gordon
patent: 6371017 (2002-04-01), Yamazaki et al.
patent: 6548790 (2003-04-01), Trucco
patent: 20010052536 (2001-12-01), Scherdorf et al.
patent: 06-320706 (1994-11-01), None

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