Manufacture of semiconductor devices and novel lead frame assemb

Details Manufacture of semiconductor devices and novel lead frame assemb Manufacture of semiconductor devices and novel lead frame assemb

1993-12-17

1995-04-18

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257730, 257735, 257693, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

054081262

ABSTRACT:
A lead frame assembly comprises a lead frame having cantilevered leads. Combined with the lead frame is a rigid, elongated base member having a U-shaped cross-section and laterally outwardly extending flanges at the upper ends of side walls of the base member. The leads of the lead frame overlie the base member flanges and are bonded to conductive paths on the flanges which extend along the flanges, along the base member side walls and onto the bottom wall of the base member. In use, a semiconductor chip is mounted on the bottom wall and wire bonded to respective ones of the conductive paths. Two base members can be used in flange-to-flange contacting relationship to provide a tubular enclosure for the chip.

REFERENCES:
patent: 3629668 (1971-12-01), Hingorany
patent: 3786375 (1974-01-01), Sato et al.
patent: 4445274 (1984-05-01), Suzuki et al.
patent: 4714952 (1987-12-01), Takeawa
patent: 4751611 (1988-06-01), Arai
patent: 4829403 (1989-05-01), Harding
patent: 4839713 (1989-06-01), Teraoka
patent: 5018005 (1991-05-01), Lin et al.
patent: 5049977 (1991-09-01), Sako
patent: 5223739 (1993-06-01), Katsumata
patent: 5256901 (1993-10-01), Ohashi et al.
patent: 5281849 (1994-01-01), Singh Deo et al.

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