Manufacture of semiconductor connection components with frangibl

Details Manufacture of semiconductor connection components with frangibl Manufacture of semiconductor connection components with frangibl

1995-03-21

1997-05-13

Picardat, Kevin

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating lead frame or beam lead

438111, 148537, 29827, H01L 2160

Patent

active

056292392

ABSTRACT:
A semiconductor chip connection component having numerous leads extending side-by-side across a gap in a support structure, each lead having a frangible section to permit detachment of one end of the lead from the support structure in a bonding process. The frangible sections are formed by treating the lead-forming material in an elongated treatment zone extending across the regions occupied by numerous leads. The process avoids the need for especially fine etching to form notches in the lateral edges of the leads.

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