Manufacture of printed circuit boards

Details Manufacture of printed circuit boards Manufacture of printed circuit boards

1990-02-09

1991-07-30

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

428209, 428210, 428426, 428457, 428901, 430311, 430312, 361397, B32B 300

Patent

active

050359398

ABSTRACT:
In the manufacture of printed circuit boards, a first photoresist post is patterned on the substrate where via holes are to be made. A dielectric layer is put down, a second photoresist layer patterned so as to have openings over and in alignment with the photoresist posts, and the dielectric removed from the via holes. Barrier layers to reduce interaction between layers of copper, dielectric and photoresist during filling of the via holes with a conductor via fill ink are also described.

REFERENCES:
patent: 4897338 (1990-01-01), Spicciati et al.
patent: 4902610 (1990-02-01), Shipley
Article of J. R. Jordan, "Protopatterned Thick Film Dielectric Production Process, Part I", Inside ISHM, Mar.-Apr. 1987, pp. 14-15.
Article of J. R. Jordan, "Photopatterned Thick Film Dielectric Production Process, Part 2", Inside ISHM, May-Jun. 1987, pp. 14-15.

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