Manufacture of printed circuit board assemblies

Details Manufacture of printed circuit board assemblies Manufacture of printed circuit board assemblies

1989-08-14

1990-10-02

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228224, 228248, 148 24, B23K 102, H05K 334

Patent

active

049602365

ABSTRACT:
To avoid the use of harmful CFCs in the cleaning of soldered printed circuit board assemblies, their manufacture is accomplished using a screen-printable solder paste composition which will in use yield minimal flux residues which will not require removal by a solvent cleaning step. The paste composition is formulated by incorporating the powdered soft solder alloy in a liquid medium containing up to 10% by weight of a non-corrosive organic flux material, a substantially water-immiscible organic solvent, and one or more thickening agents.

REFERENCES:
patent: 3716347 (1973-02-01), Bergstrom
patent: 4504007 (1985-03-01), Anderson et al.
patent: 4661173 (1987-04-01), Barajas et al.
patent: 4701224 (1987-10-01), Zado
patent: 4759490 (1988-07-01), Ochiai

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