Manufacture of microelectronic fold packages

Details Manufacture of microelectronic fold packages Manufacture of microelectronic fold packages

2007-01-02

2007-01-02

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S062000, C438S109000, C257S686000, C257S723000, C257S724000, C257S725000, C257SE21499

Reexamination Certificate

active

10950241

ABSTRACT:
An elongated strip of a sheetlike substrate bearing microelectronic elements such as semiconductor chips is advanced in a downstream direction through one or more folding stations where successive portions of the substrate are folded so as to form a strip including a plurality of fold packages, each including confronting top and bottom runs and a fold region with one or more of the runs bearing one or more microelectronic elements. The strip incorporating the plural fold packages can be wound on a reel or otherwise handled, stored and shipped to a subsequent manufacturing operation, where individual fold packages can be severed from the strip.

REFERENCES:
patent: 4814855 (1989-03-01), Hodgson et al.
patent: 6121676 (2000-09-01), Solberg
patent: 6225688 (2001-05-01), Kim et al.
patent: 6699730 (2004-03-01), Kim et al.
patent: 2003/0168725 (2003-09-01), Warner et al.
patent: 2004/0099938 (2004-05-01), Kang et al.
patent: 2004/0115866 (2004-06-01), Bang et al.
patent: 2004/0145054 (2004-07-01), Bang et al.
patent: 2004/0209400 (2004-10-01), Meyers
patent: 2004/0238931 (2004-12-01), Haba et al.
patent: WO-2004/017399 (2004-02-01), None
patent: WO-2004/023546 (2004-03-01), None
patent: WO-2004/025699 (2004-03-01), None
Bang et al., U.S. Appl. No. 10/640,177, filed Aug. 13, 2003.
Fjelstad, U.S. Appl. No. 10/077,388, filed Feb. 15, 2002.
Humpston et al. U.S. Appl. No. 60/549,176, filed Mar. 1, 2004.
Humpston et al., U.S. Appl. No. 60/561,210, filed Apr. 9, 2004.
Thompson et al., U.S. Appl. No. 10/969,527, filed Oct. 20, 2004.

Affiliated with

Also associated with

Rating

Manufacture of microelectronic fold packages does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacture of microelectronic fold packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacture of microelectronic fold packages will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3742865