Metal working – Barrier layer or semiconductor device making – Barrier layer device making
Patent
1996-09-03
1998-12-01
Johnson, Linda
Metal working
Barrier layer or semiconductor device making
Barrier layer device making
298901, 156257, H04K 1700
Patent
active
058422587
ABSTRACT:
Ink jet printhead components are formed initially by bonding together a grooved base wafer and a suitable cover wafer, the area of the bonding wafer assembly being sufficient to provide a 14.times.14 array of components. Using a datum formation, the wafer assembly is divided into strips and linear processing steps are conducted, such as applying nozzle plates and laser ablating nozzles. Each strip can then be divided to form separate printhead components.
REFERENCES:
patent: 4789425 (1988-12-01), Drake et al.
patent: 5010356 (1991-04-01), Albinson
patent: 5016028 (1991-05-01), Temple
patent: 5041190 (1991-08-01), Drake et al.
patent: 5160403 (1992-11-01), Fisher et al.
patent: 5185055 (1993-02-01), Temple et al.
patent: 5189437 (1993-02-01), Michaelis et al.
Harvey Robert Alan
Temple Stephen
Johnson Linda
Xaar Technology Limited
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