Manufacture of ink jet printheads

Details Manufacture of ink jet printheads Manufacture of ink jet printheads

1996-09-03

1998-12-01

Johnson, Linda

Metal working

Barrier layer or semiconductor device making

Barrier layer device making

298901, 156257, H04K 1700

Patent

active

058422587

ABSTRACT:
Ink jet printhead components are formed initially by bonding together a grooved base wafer and a suitable cover wafer, the area of the bonding wafer assembly being sufficient to provide a 14.times.14 array of components. Using a datum formation, the wafer assembly is divided into strips and linear processing steps are conducted, such as applying nozzle plates and laser ablating nozzles. Each strip can then be divided to form separate printhead components.

REFERENCES:
patent: 4789425 (1988-12-01), Drake et al.
patent: 5010356 (1991-04-01), Albinson
patent: 5016028 (1991-05-01), Temple
patent: 5041190 (1991-08-01), Drake et al.
patent: 5160403 (1992-11-01), Fisher et al.
patent: 5185055 (1993-02-01), Temple et al.
patent: 5189437 (1993-02-01), Michaelis et al.

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