Manufacture of high precision electronic components with ultra-h

Details Manufacture of high precision electronic components with ultra-h Manufacture of high precision electronic components with ultra-h

1995-09-07

1999-09-07

Booth, Richard A.

Metal working

Barrier layer or semiconductor device making

438906, 1341022, 134902, H01L 2100, H01L 2164

Patent

active

RE0362905

ABSTRACT:
Semiconductor wafers and other electronic parts which similarly require ultra-high purity manufacturing environments are treated with ultra-high purity liquid cleaning and etching agents prepared at the site of use from gaseous raw materials which have been purified to a level compatible with semiconductor manufacturing standards, combined when appropriate with ultra-pure water.

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English translation of Decision of Rejection issued in Japanese related Application No. 511640/92, Jul. 1998.

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