Incremental printing of symbolic information – Light or beam marking apparatus or processes – Scan of light
Reexamination Certificate
2000-07-18
2003-03-18
Barlow, John (Department: 2853)
Incremental printing of symbolic information
Light or beam marking apparatus or processes
Scan of light
C438S108000
Reexamination Certificate
active
06535237
ABSTRACT:
TECHNICAL FIELD
This invention relates to a wide array thermal ink-jet print head for a printer.
BACKGROUND OF THE INVENTION
Thermal ink-jet printers have become widely popular as inexpensive printing devices. An essential feature of a thermal ink-jet printer is a print head that is controlled to selectively eject tiny droplets of ink onto a printing surface, such as a piece of paper, to form desired images and characters.
The print head generally has an architecture plate with multiple tiny nozzles through which ink droplets are ejected. Adjacent to the nozzles are ink chambers, where ink is stored prior to ejection through the nozzles. Ink is delivered to the ink chambers through ink channels that are in fluid communication with an ink supply.
The print head usually is formed of a sandwich construction, having a substrate at its base. Attached to the substrate is a layer of circuit traces and a layer of the resistors. The resistors are overlaid with a protective, passivation layer. The architecture plate is bonded to the substrate and substantially covers the other layers.
The resistors are lined up beneath the chambers in the architecture plate. Electrical signal inputs to the resistors “fire” the resistors, heating the resistors and thereby a volume of ink within the adjacent ink chamber. The heating generates a vapor bubble in the ink to force an ink droplet out of the nozzle.
Usually, remote bus lines provide signal inputs from an external signal source to the resistors on the print head. Oftentimes, the signals are delivered through multiplexed circuitry on the substrate. The print head is generally connected to these bus lines by a thin flat electrical cable, such as a tape automated bond (“TAB”) circuit. A TAB circuit generally has copper leads supported on a copper-coated tape. The tape is usually bonded onto the print heads with gold bump contacts. Conventional TAB circuit bonding cannot be done over live silicon circuitry without damaging the circuitry and requires use of an encapsulant to protect the leads from the ink, which adds a process step and decreases the robustness of the bond. Nevertheless, TAB circuit bonding is generally used because it is space-efficient, allowing the contact to be made in a tiny area.
In most ink-jet printers, the print head is mounted on an ink pen that is mounted to a carriage that traverses the printing surface to move the print head back and forth over the printing surface. Thus, the print head can be made relatively small in comparison to the width of the printing surface because the ink pen traverses the width of the printing surface. However, it takes the carriage a certain amount of time to traverse the paper, which slows down the speed of printing.
One way to increase the printing speed is to increase the number of nozzles on the print head, which necessitates an increase in the size of the print head. However, increasing the size of the print head requires a larger architecture plate, and a large architecture plate increases the likelihood of failure of the bonding of the interface between the architecture plate and the substrate. One reason for such failure is that the materials for the substrate and the architecture plate usually have considerably different coefficients of thermal expansion. Thus, the sandwich construction may bow or delaminate after assembly as the print head is heated and cooled during operation.
Sometimes, components within ink-jet printers are attached together by flip-chip processing. Flip-chip processing is the term used to describe the method of attaching two parts, such as a die and a substrate, by providing both parts with solderable pads, depositing a solder ball on the solderable pad on the substrate, then placing the solderable pad of the die on top of the solder ball, and heating and pressing the die and substrate to form a solder joint. Often, the solder ball is formed by depositing solder paste on the solderable pad on the substrate and heating the paste and pad to reflow the solder paste into a solder ball.
Oftentimes, after the two parts are attached by flip chip processing, an underfill made of liquid epoxy will be shot between the parts and allowed to wick therebetween, in a process separate from flip-chip processing. The underfill layer comprising the cured epoxy fills gaps between the parts and relieves some of the stress on the solder joint.
Page wide array printheads have been disclosed in U.S. Pat. No. 6,135,586, filed on behalf of Paul H. McClelland et al. on Oct. 31, 1995, titled “Large Area InkJet Printhead” and U.S. Pat. No. 6,017,117, filed on behalf of Paul H. McClelland et al. on Oct. 31, 1995, titled “Printhead With Pump Driven Ink Circulation”. These applications are assigned to the assignee of the present invention.
SUMMARY OF THE INVENTION
The invention generally includes a method of manufacturing a fluid ejection device by providing a substrate; attaching a plurality of resistors to a portion of the substrate for heating fluid; attaching a plurality of solderable interconnect pads to another portion of the substrate; soldering at least one chip onto the interconnect pads; and electrically connecting the resistors with the chip by attaching a layer having circuit traces that run from the interconnect pads to the resistors, whereby the chip is operable to control the resistors.
REFERENCES:
patent: 4500895 (1985-02-01), Buck et al.
patent: 4550612 (1985-11-01), Yamada et al.
patent: 4680859 (1987-07-01), Johnson
patent: 4695853 (1987-09-01), Hackleman et al.
patent: 4862197 (1989-08-01), Stoffel
patent: 5016023 (1991-05-01), Chan et al.
patent: 5070410 (1991-12-01), Hadley
patent: 5133495 (1992-07-01), Angulas et al.
patent: 5203075 (1993-04-01), Angulas et al.
patent: 5227812 (1993-07-01), Watanabe et al.
patent: 5278584 (1994-01-01), Keefe et al.
patent: 5279711 (1994-01-01), Frankeny et al.
patent: 5323084 (1994-06-01), Haitz
patent: 5369880 (1994-12-01), Gundotra et al.
patent: 5433995 (1995-07-01), Noguchi
patent: 5439956 (1995-08-01), Noguchi
patent: 5442384 (1995-08-01), Schantz et al.
patent: 5453581 (1995-09-01), Liebman et al.
patent: 5539153 (1996-07-01), Schwiebert et al.
patent: 5543585 (1996-08-01), Booth et al.
patent: 5545465 (1996-08-01), Gaynes et al.
patent: 5583747 (1996-12-01), Baird et al.
patent: 5777576 (1998-07-01), Zur et al.
patent: 6017117 (2000-01-01), McClelland
patent: 6113216 (2000-09-01), Wong
patent: 6135586 (2000-10-01), McClelland et al.
patent: 6228681 (2001-05-01), Gilleo et al.
An Innovative Bonding technique for Optical Chips Using Solder Bumps that Eliminate Chip Positioning Adjustments, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 15, No. 2, Apr. 1992, pp. 225-230.
LandOfFree
Manufacture of fluid ejection device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Manufacture of fluid ejection device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacture of fluid ejection device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3031125