Manufacture of dendrites and their use

Details Manufacture of dendrites and their use Manufacture of dendrites and their use

1999-08-10

2001-11-27

Reichard, Dean A. (Department: 2831)

Electricity: conductors and insulators

Insulators

Multiple insulator assemblies

C439S066000, C117S903000, C200S511000

Reexamination Certificate

active

06323432

ABSTRACT:

FIELD OF THE INVENTION
This invention relates generally to the manufacture of dendritic particles, and the use thereof and, more particularly, to the manufacture of acicular branched metal dcendritic particles, and the use thereof
BACKGROUND INFORMATION
Traditionally, springs and pins have been used to provide connection between electrical elements such as pads. However, as densities increase, these types of connections are often not sufficient. With higher densities, compressible pad-on-pad connections are often used. While in many cases these types of connectors are very useful, nevertheless in some instances they are not completely reliable. For example, when the pads or other contacts have films, such as oxide films or the like or dust particles, or any other surface contaminants, or connectors that use a conductive elastomer/plastic material, such conductive elastomers may not provide the necessary contact with the pads. This is because the conductive elastomer is normally provided with relatively soft metal conducting particles, such as silver. When the particles encounter the film, they may not penetrate the film, but rather deform, leaving the film as an insulating barrier between the conductive pad and the conductive particles. This sometimes results in less than the quality connection required.
SUMMARY OF THE INVENTION
According to the present invention, a technique for making acicular, branched, conductive dendrites, and a technique for using the dendrites to form a conductive compressible pad-on-pad connector are provided. To form the dendrites, a substrate is provided on which dendrites are grown, preferably on a metal film. The dendrites are then removed from the substrate, preferably by etching metal from the substrate. The so formed dendrites are incorporated into a compressible dielectric material, which then forms a compressible pad-on-pad connector between two conducting elements, such as connector pads on electrical devices, e.g. an I/C chip mounted on a substrate, such as a chip carrier.


REFERENCES:
patent: 4449774 (1984-05-01), Takashi et al.
patent: 4740657 (1988-04-01), Tsukagoshi et al.
patent: 4814040 (1989-03-01), Ozawa
patent: 4902857 (1990-02-01), Cranston et al.
patent: 5001302 (1991-03-01), Atsumi
patent: 5019944 (1991-05-01), Ishii et al.
patent: 5045249 (1991-09-01), Jin et al.
patent: 5061192 (1991-10-01), Chapin et al.
patent: 5137461 (1992-08-01), Bindra et al.
patent: 5163834 (1992-11-01), Chapin et al.
patent: 5185073 (1993-02-01), Bindra et al.
patent: 5213715 (1993-05-01), Patterson et al.
patent: 5248262 (1993-09-01), Busacco et al.
patent: 5338532 (1994-08-01), Tomalia et al.
patent: 5431571 (1995-07-01), Hanrahan et al.
patent: 5527524 (1996-06-01), Tomalia et al.
patent: 5600259 (1997-02-01), Bartyzel et al.
patent: 5613862 (1997-03-01), Naylor
patent: 5636996 (1997-06-01), Johnson et al.
patent: 5899757 (1999-05-01), Neidich et al.
patent: 5939786 (1999-08-01), Downes, Jr. et al.
patent: 401198092A (1989-08-01), None
“Encapsulated Dendrite Electrical Interconnect for Surface Mount Applications”, vol. 38, No. 08, IBM Technical Disclosure Bulletin, Aug., 1995, pp. 267-268.

Affiliated with

Also associated with

Rating

Manufacture of dendrites and their use does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacture of dendrites and their use, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacture of dendrites and their use will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2605707