Manufacture of chipboard having high strength and reduced formal

Details Manufacture of chipboard having high strength and reduced formal Manufacture of chipboard having high strength and reduced formal

1979-12-18

1981-08-04

Nielsen, Earl A.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

260 173, C08L 6124, C08L 9702

Patent

active

042821193

ABSTRACT:
Chipboard showing a strongly reduced formaldehyde-emission is prepared on the basis of cellulose-containing material with a urea-formaldehyde or urea-melamine-formaldehyde resin as a binder, wherein said binder contains 0.45 to 0.65 mole of formaldehyde per mole-equivalent of amino groups and to which between 2 and 20% by wt., relative to the resin, of a protein soluble or dispersible in the resin solution has been added. The resin preferably contains between 25 and 45% by wt. of melamine, relative to the combined amount of urea and melamine. The boards have good strength and weather resistance, and have a very low formaldehyde emission.

REFERENCES:
patent: 3471420 (1969-10-01), Campbell
patent: 3598773 (1971-10-01), Mittchell et al.
Chem. Absts., vol. 64:2279c, CIBA, Particle Board.
Chem. Absts., vol. 64:3799e, Kolodkine, Binders for Particle Board.
Chem. Absts., vol. 64:17818f, Herberts and Co.-Veneer Binder.
ABIPC, vol. 37, No. 7, 1/67, #5530-Improvements . . . Particle Boards, Rayner, C.A.A.

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