Manufacture of chipboard and a novel suitable bonding agent

Details Manufacture of chipboard and a novel suitable bonding agent Manufacture of chipboard and a novel suitable bonding agent

1984-02-01

1985-04-09

Kight, John

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

524 27, 1563313, 1563318, 264109, 428407, 428528, B29J 500

Patent

active

045102783

ABSTRACT:
An improved method for the preparation of particleboard wherein a cellulose-containing particulate material is provided with a urea formaldehyde resin bonding agent and thereafter shaped and hardened at an elevated temperature and pressure. The bonding agent used is a urea-formaldehyde resin solution additionally containing melamine in an amount of 1.0 and 10 percent by weight, relative to the total amount of resin solids. The molar ratio of formaldehyde to mole equivalents of amino groups in the bonding agent is in the range of between 0.500:1 and 0.575:1.

REFERENCES:
patent: 2328424 (1943-08-01), D'Alelio
patent: 2768754 (1956-10-01), Briggs
patent: 2772197 (1956-11-01), Kozdemba
patent: 3097177 (1963-07-01), Emerson
patent: 3905847 (1975-09-01), Black
patent: 4362827 (1982-12-01), Tinkelenberg et al.

Affiliated with

Also associated with

Rating

Manufacture of chipboard and a novel suitable bonding agent does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacture of chipboard and a novel suitable bonding agent, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacture of chipboard and a novel suitable bonding agent will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1170278