Manufacture of a multi-layer interconnect structure

Details Manufacture of a multi-layer interconnect structure Manufacture of a multi-layer interconnect structure

1995-03-01

1996-11-26

Fiorilla, Christopher A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

101129, 156 89, 427 97, B32B 3100

Patent

active

055781519

ABSTRACT:
In the manufacture of multi-layer ceramic interconnect structures, a greensheet is perforated with small holes and positioned on the support fixture of a screening machine. Then a planar surface of a screening mask is positioned in relation to the greensheet for producing the circuit pattern. Then the discharge end of a paste nozzle is positioned in relation to the opposite planer surface of the mask for injecting pressurized conductive paste through the nozzle into the mask. A normal force is applied to the nozzle toward the mask to maintain the discharge end of the nozzle with a clearance of 1 to 2 mils from the mask as the nozzle traverses the mask, injecting the conductive paste to extrude the circuit pattern on the greensheet and fill the perforations to produce vias to provide electrical connections between the layers produced. The force is adjusted dependent upon the pressure of the paste being injected into the mask to maintain the 1 to 2 mil clearance. Multiple layers of patterned greensheets are stacked and sintered under pressure and high temperature to produce the multi-layer ceramic interconnect structure.

REFERENCES:
patent: 3384931 (1966-06-01), Cochran et al.
patent: 4245273 (1981-01-01), Feinberg et al.
patent: 4622239 (1986-11-01), Schoenthaler et al.
patent: 4661368 (1987-04-01), Rohde et al.
patent: 4720402 (1988-01-01), Wojcik
patent: 4808435 (1989-02-01), Cropp et al.
Patent Abstracts of Japan; vol. 9, No. 91 (C-277) 19 Apr. 1985 & JP-A-59 222 256 (Sony KK) *abstract*.
IBM Technical Disclosure Bulletin, vol. 25, No. 6, Nov. 1982; "Screening Nozzle With Non-Line Contact"; R. C. Brilla et al.; pp. 2723-2724.

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