Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-03-06
2007-03-06
Trinh, Minh (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S847000, C174S254000, C216S018000, C361S794000
Reexamination Certificate
active
11350032
ABSTRACT:
A flexible multilayer wiring board manufactured by laminating a metal foil via an insulating layer to cover the first layer circuit wiring formed on a conductive substrate, and a resist layer is formed to cover the second layer circuit wiring formed by pattern-etching the metal foil. Using the conductive substrate as a power feeding layer, a conductive material is filled, by electrolytic plating, into interlayer via holes each formed applying a laser beam to the resist layer to establish interlayer connection between the first and second layer circuit wirings. Using the conductive substrate as a power feeding layer, a conductive material is filled, by electrolytic plating, into hole portions of an insulating layer formed to cover the second layer circuit wiring to form external connection terminals. Then, the conductive substrate is removed entirely or partly to expose the first layer circuit wiring.
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Kumon Shinji
Kusano Hidetoshi
Dai Nippon Insatsu Kabushiki Kaisha
Nguyen Donghai D.
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Sony Corporation
Trinh Minh
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