Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2011-08-16
2011-08-16
Geyer, Scott B (Department: 2812)
Semiconductor device manufacturing: process
With measuring or testing
Packaging or treatment of packaged semiconductor
C438S066000, C438S118000, C136S290000
Reexamination Certificate
active
07998760
ABSTRACT:
After overlaying a conductive adhesive film and the wiring material on an electrode of a solar cell and temporarily fixing the wiring material to the solar cell by pressure bonding under first temperature/pressurizing condition, the quality of the temporarily fixed solar cell is inspected, a solar cell determined to be defective in the inspection step is removed and the defective solar cell is replaced with a non-defective solar cell. Then, the wiring material is temporarily fixed to the non-defective solar cell by pressure bonding the wiring material with the conductive adhesive film interposed therebetween, under the first temperature/pressurizing condition and the wiring materials are fixed to the solar cell by thermally setting the conductive adhesive film under second temperature condition to apply heat higher than the first temperature condition.
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Ditthavong Mori & Steiner, P.C.
Geyer Scott B
Sanyo Electric Co,. Ltd.
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