Manually operable die attach apparatus

Details Manually operable die attach apparatus Manually operable die attach apparatus

1993-03-12

1994-08-09

Aftergut, Jeff H.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Work-secured and/or work-guided

156285, 156299, 156556, 156569, 156579, 156578, 29840, H05K 330, B23P 1900

Patent

active

053363574

ABSTRACT:
A manually operable apparatus for selectively assembling chips to substrates comprises a support base having a first support for supporting a substrate preparatory to attachment of a chip thereto, second support for supporting a chip preparatory to selection for attachment to a substrate, a manually operable swing arm assembly mounted on the support base and having a first arm for placement of an adhesive paste to a surface of a substrate on the first support and a second arm for selecting and placing a chip on the substrate.

REFERENCES:
patent: 3715258 (1973-02-01), Cunnane
patent: 3834966 (1974-09-01), Kelly
patent: 3855034 (1974-12-01), Miller
patent: 4239576 (1980-12-01), Taki et al.
patent: 4636254 (1987-01-01), Husson, Jr.
patent: 4761224 (1988-08-01), Husson, Jr.
patent: 4868979 (1989-09-01), Fukushima et al.
patent: 4951388 (1990-08-01), Eguchi et al.
patent: 4968738 (1990-11-01), Dershem
patent: 5155903 (1992-10-01), Nakashima et al.

Affiliated with

Also associated with

Rating

Manually operable die attach apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manually operable die attach apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manually operable die attach apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-213801