Manually operable die attach apparatus

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Work-secured and/or work-guided

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Details

156285, 156299, 156556, 156569, 156579, 156578, 29840, H05K 330, B23P 1900

Patent

active

053363574

ABSTRACT:
A manually operable apparatus for selectively assembling chips to substrates comprises a support base having a first support for supporting a substrate preparatory to attachment of a chip thereto, second support for supporting a chip preparatory to selection for attachment to a substrate, a manually operable swing arm assembly mounted on the support base and having a first arm for placement of an adhesive paste to a surface of a substrate on the first support and a second arm for selecting and placing a chip on the substrate.

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patent: 4968738 (1990-11-01), Dershem
patent: 5155903 (1992-10-01), Nakashima et al.

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