Manual electronic-part mounting method

Details Manual electronic-part mounting method Manual electronic-part mounting method

1999-06-30

2000-11-28

Pianalto, Bernard

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

4272086, 4272088, 427261, 4274071, 4274301, B05D 512

Patent

active

06153255&

ABSTRACT:
A manual electronic-part mounting apparatus includes a manual adhesive coating apparatus, a manual electronic-part fitting apparatus, and a manual printed-wiring-board checking apparatus. The manual adhesive coating apparatus has a pressing plate portion to which a large number of needles are fitted, being arranged such that the needles with the adhesive are brought in contact with a printed-wiring board, thereby the adhesive being coated on predetermined positions of the printed-wiring board. The manual electronic-part fitting apparatus has a large number of electronic-part supply rods. The electronic-part supply rod has an electronic-part storage rod supported by a fixed plate and an extruding rod supported by a movable plate. When the movable plate is moved relative to the fixed plate, the chip-type electronic part is extruded from an end-portion side aperture of the electronic-part storage rod.

REFERENCES:
patent: 4548667 (1985-10-01), Wical
patent: 4951388 (1990-08-01), Eguchi et al.
patent: 5336357 (1994-08-01), Layher et al.

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